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The Engis HYPREZ® Total Diamond Lapping and Polishing System
  • Lapping and Polishing
  • Engis Corporation
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    HYPREZ® Planarization & Polishing Pads

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    Engis Corporation Engis Corporation In polishing operations, the holder of the abrasive is as important as the abrasive itself. The choice and composition of this holder is determined by your application and the materials you are processing. In extremely fine polishing operations you must use cloth, rather than, or in addition to composite plates.

    Engis offers a full selection of pads and cloths to meet demanding polishing and planarization requirements for your industrial as well as advanced material finishing. In addition to industry standard pads, Engis can engineer and supply special pads to meet your needs.

    Qualification criteria makes our cloths the best available in the industry. Using an array of test materials and slurries, extensive evaluations are performed to meet exacting Engis standards for systems performance.

    Polishing pads are divided into three broad categories of fabric – woven, flocked and compressed with most offerings available with or without pressure sensitive adhesive backing. In addition, perforations or grooving, which act to enhance your surface finish, are available on some pads. Common pad applications include:

    Optical components: LiNbO3, CaF2, MgF2, Si, Ge, KTP, DKDP, etc.
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    Planarization of MEMS structures
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    Semiconductor materials: InP, Sapphire, GaSb, InSb, SoS, SiC, GaN, etc.
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    Polishing of high grade metal substrates: Titanium, Nickel, Copper, Gold, etc.
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    Industrial metals: Aluminum, Carbide, Steel, Bronze, etc.
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    Industrial Ceramics, Glass & Quartz
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    HYPREZ® Planarization & Polishing Pads
    Engis Corporation
    Engis supplies a wide variety of pads and cloths to handle both diamond and non-diamond flat polishing processes.


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    Pad Selection and Application Guide
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    MEDIUM NAP
    Medium Nap
    Click image to enlarge
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    MICRO CELL
    Micro Cell
    Click image to enlarge
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    WOVEN
    Woven
    Click image to enlarge
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    RIGID
    NON-WOVEN
    Rigid Non-Woven
    Click image to enlarge
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    TYPE  Rigid Non-Woven Pad             X   X X   X
     Woven Cloth   X X                  
     Micro Cell Pad       X             X  
     Medium Nap X       X X   X        
    EDGE
    ROUNDING
     High X         X   X        
     Medium       X X   X       X  
     Low   X X           X X   X
    DIAMOND
    SIZE
     Colloids X     X X   X X X X X X
     0.05 Micron X     X   X     X X X  
     0.1 Micron X   X X X X     X X X X
     0.25 Micron X   X X X X X   X X X X
     0.5 Micron X   X X X X X   X X X X
     1 Micron     X X X X X   X X X X
     3 Micron   X X X X X X   X X X X
     6 Micron   X     X       X     X
     9 Micron   X                   X
     15 Micron   X                   X
     30 Micron   X                    
     45 Micron   X                    
    USES  Rough Polish   X                    
     Intermediate Polish   X X     X X   X X   X
     Final Polish X X X X X X X X X X X X
    COMPARISON
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     Suba 4             X     X   X
     Suba X             X          
     H4                   X   X
     Pellon             X         X
     Politex Supreme       X             X  
     Lam Plan 415   X                    
     Lam Plan 431 X       X X   X        
     Lam Plan 432       X             X  
     Lam Plan 437         X X            
     Lam Plan 450
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        X           X      
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    We provide the best Process Development, Sales and Customer Support in the industry.
    Contact your local Engis
    Regional Sales Manager or Customer Service Representative.


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